A low-cost concurrent TSV test architecture with lossless test output compression scheme

• Young-woo Lee,

  Roles Conceptualization, Writing – original draft

  Affiliation Department of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea

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• Hyunchan Lim,

  Roles Investigation

  Affiliation Department of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea

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• Sungyoul Seo,

  Roles Investigation

  Affiliation Department of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea

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• Keewon Cho,

  Roles Validation

  Affiliation Department of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea

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• Sungho Kang

  Roles Funding acquisition, Supervision, Writing – review & editing

  * E-mail: shkang@yonsei.ac.kr

  Affiliation Department of Electrical and Electronic Engineering, Yonsei University, Seoul, Korea

  http://orcid.org/0000-0002-7093-2095

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