Fig 1.
Glass embossing deformation research review at the macroscopic level and molecular dynamics.
(a) Photograph of dimples produced by continuous laser irradiation of glass [12]; (b) SEM image of embossing on 100 nm glass [14]; (c) Plastic deformation at a sample size of 100 nm [15]; and (d) EDGE stress evolution and stress evolution by displacement. Silicon atoms are coloured by stress and carbon atoms are grey. Oxygen atoms are empty [26]; (e) Indentation depth at an indenter angle of 90° [27].
Fig 2.
Atoms are colored by different control methods and types. The gray and red atoms are Cr atoms, and the former ones are set rigid, and the latter ones are under constant temperature control. The blue atoms consisting of Si and O atoms are also under constant temperature control.
Fig 3.
Temperature dependent density and glass transition temperature.
Fig 4.
Density evolution during the glass embossing process.
The density is normalized to the density of the glass.
Fig 5.
Potential energy evolution during the glass embossing process.
Fig 6.
Displacement vectors between 42 ps and 48 ps. The bottom figure is the zoomed-in view of the top figure on the right.
The displacement vectors are chosen randomly to better visualize the arrows.
Fig 7.
Temperature effect on embossing at 40 ps.
Fig 8.
Crack evolution during MD tensile test and stress-strain curve under different strain rates.
Fig 9.
Stress evolution during the glass embossing process.