Figure 1.
Three patterns on the photo mask for fabricate silicon mold.
Table 1.
The dimensions of the micro patterns for different molds.
Figure 2.
Thermal assisted ultrasonic embossing system.
Figure 3.
Thermal assisted ultrasonic embossing (a) schematic process; (b) the force and amplitude in an ultrasonic embossing process.
Table 2.
Results of the orthogonal experiments.
Figure 4.
The temperature testing system (a) schematic of the system; (b) position of the thermocouples.
Figure 5.
The temperature curve on both sides of the PMMA substrate in embossing.
Figure 6.
The relationship between embossing parameters (a) replication rate; (b) replication uniformity.
Table 3.
The analysis of variance results of embossing parameters.
Figure 7.
SEM images of embossed microstructure (a) longitudinal-stripe style; (b) checked style.
Table 4.
Replication results of 1 mm PMMA substrate.
Figure 8.
Stress distribution in the substrates with different thickness(a) 1 mm PMMA substrate; (b) 2 mm PMMA substrate.
Table 5.
The embossing parameters and replication depth with different molds.