A modeling method for thermal steady-state simulation of the four-layer printed circuit board

• Yabin Zhang ,

  Roles Funding acquisition, Methodology, Project administration, Software, Writing – original draft, Writing – review & editing

  * E-mail: 1220170062@mail.xhu.edu.cn

  Affiliation School of Electrical Engineering and Electronic Information, Xihua University, Chengdu, Sichuan, P.R. China

  https://orcid.org/0000-0001-5910-163X

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• Lin Chen

  Roles Software, Validation, Writing – review & editing

  Affiliation School of Electrical Engineering and Electronic Information, Xihua University, Chengdu, Sichuan, P.R. China

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