Numerical simulation of high-temperature thermal contact resistance and its reduction mechanism

• Donghuan Liu ,

  Roles Data curation, Funding acquisition, Investigation, Writing – original draft, Writing – review & editing

  * E-mail: liudh@ustb.edu.cn

  Affiliation Beijing Key Laboratory for Magneto-Photoelectrical Composite and Interface Science, School of Mathematics and Physics, University of Science and Technology Beijing, Beijing, P.R. China

  http://orcid.org/0000-0002-9512-8431

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• Jing Zhang

  Roles Methodology, Writing – review & editing

  Affiliation Basic Experimental Center for Natural Science, University of Science and Technology Beijing, Beijing, P.R. China

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