A New Model for Temperature Jump at a Fluid-Solid Interface

Open Access

Peer-reviewed

Research Article

Jian-Jun Shu ,

* E-mail: mjjshu@ntu.edu.sg

Affiliation School of Mechanical & Aerospace Engineering, Nanyang Technological University, Singapore, Singapore
⨯
Ji Bin Melvin Teo,

Affiliation School of Mechanical & Aerospace Engineering, Nanyang Technological University, Singapore, Singapore
⨯
Weng Kong Chan

Affiliation School of Mechanical & Aerospace Engineering, Nanyang Technological University, Singapore, Singapore
⨯

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Temperature gradients
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Adsorption
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Argon
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Liquids
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Simulation and modeling
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Surface temperature
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Helium
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Velocity
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