Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

Open Access

Peer-reviewed

Research Article

Gan Chong Leong ,

* E-mail: clgan_pgg@yahoo.com

Current address: Spansion (Penang) Sdn Bhd, Bayan Lepas, Penang, Malaysia

Affiliation Institute of Nano Electronic Engineering (INEE), Universiti Malaysia Perlis, Kangar, Perlis, Malaysia
⨯
Hashim Uda

Affiliation Institute of Nano Electronic Engineering (INEE), Universiti Malaysia Perlis, Kangar, Perlis, Malaysia
⨯

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Reliability
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Copper
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Mass diffusivity
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Corrosion
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Intermetallics
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Gold
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Palladium
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Oxidation
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