About the Authors
- Qiuyuan Huang
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Contributed equally to this work with: Qiuyuan Huang, Brandon R. Briggs
Affiliations Department of Geology and Environmental Earth Science, Miami University, Oxford, Ohio, United States of America, Department of Microbiology, University of Georgia, Athens, Georgia, United States of America
- Brandon R. Briggs
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Contributed equally to this work with: Qiuyuan Huang, Brandon R. Briggs
Affiliation Department of Geology and Environmental Earth Science, Miami University, Oxford, Ohio, United States of America
- Hailiang Dong
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* E-mail: dongh@miamioh.edu
Affiliations Department of Geology and Environmental Earth Science, Miami University, Oxford, Ohio, United States of America, State Key Laboratory of Biogeology and Environmental Geology, China University of Geosciences, Beijing, China, State Key Laboratory of Biogeology and Environmental Geology, China University of Geosciences, Wuhan, China
- Hongchen Jiang
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Affiliation State Key Laboratory of Biogeology and Environmental Geology, China University of Geosciences, Wuhan, China
- Geng Wu
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Affiliation State Key Laboratory of Biogeology and Environmental Geology, China University of Geosciences, Wuhan, China
- Christian Edwardson
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Affiliation Department of Microbiology, University of Georgia, Athens, Georgia, United States of America
- Iwijn De Vlaminck
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Affiliation Departments of Bioengineering and Applied Physics, Stanford University and the Howard Hughes Medical Institute, Stanford, California, United States of America
- Stephen Quake
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Affiliation Departments of Bioengineering and Applied Physics, Stanford University and the Howard Hughes Medical Institute, Stanford, California, United States of America
Competing Interests
The authors have declared that no competing interests exist.
Author Contributions
Conceived and designed the experiments: BRB HD HJ. Performed the experiments: QH BRB CE IV GW. Analyzed the data: QH BRB. Contributed reagents/materials/analysis tools: CE IV SQ. Contributed to the writing of the manuscript: QH BRB HD HJ GW CE IV SQ.