The name of the first author of the article is incorrect. The first author's correct name is: Chong Leong Gan. The correct Citation is: Chong Leong G, Uda H (2013) Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging. PLoS ONE 8(11): e78705. doi:10.1371/journal.pone.0078705. The correct abbreviation of the first author's name in the Author Contributions statement is: CLG.
Citation: Chong Leong G, Uda H (2014) Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging. PLoS ONE 9(1): 10.1371/annotation/21a4e441-0c3f-4319-9833-91d316b99d43. https://doi.org/10.1371/annotation/21a4e441-0c3f-4319-9833-91d316b99d43
Published: January 2, 2014
Copyright: © 2014 . This is an open-access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited.
Competing interests: No competing interests declared.